henkel-logo-thumbElectronic Manufacturing Materials

Material CategoryPotential Advantages of ULS DLMP® SolutionSpecific Material(s)Material Processing Notes
Electrically Conductive Tapes
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
  • Emerson & Cuming CF3350
Thermally Conductive Interface Pads
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No compression of material during cutting
  • No tooling required
  • No gumming of tooling
  • Bergquist Gap Pad Products
  • Bergquist Hi-Flow Products
  • Bergquist Sil-Pad Products
Thermally Conductive Tapes
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
  • LOCTITE ABLESTIK ECF 563