Electronic Manufacturing Materials

Material Category	Potential Advantages of ULS DLMP^® Solution	Specific Material(s)	Material Processing Notes
Gap Fill Materials	Smooth edge with no lip or debris Complex geometries with small features No compression of material during cutting No tooling required	BISCO® Cellular Silicone PORON® Microcellular Urethane	Rogers Corporation™ BISCO® BF-1000 Rogers Corporation™ PORON® 4701-30
RF Substrates	Multiple material compatibility Selective ablation of copper conductor from insulating core Direct patterning of circuit No photolithography No chemicals Complex geometries with small features No tooling required	CuClad® Laminates RO4000® LoPro® Laminates
Thermally Conductive Tapes	Smooth edge with no lip or debris Complex geometries with small features No tooling required No gumming of tooling	COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA)