Electronic Manufacturing Materials

Material Category	Potential Advantages of ULS DLMP^® Solution	Specific Material(s)	Material Processing Notes
Gap Fill Materials	Smooth edge with no lip or debris Complex geometries with small features No compression of material during cutting No tooling required	BISCO® Cellular Silicone PORON® Microcellular Urethane	Rogers Corporation™ BISCO® BF-1000 Rogers Corporation™ PORON® 4701-30
Thermally Conductive Tapes	Smooth edge with no lip or debris Complex geometries with small features No tooling required No gumming of tooling	COOLSPAN® Thermally & Electrically Conductive Adhesive (TECA)