ULTRA R5000

Key Features and Capabilities

  • Material processing area of 32 x 24 in. (813 mm x 610 mm)
  • Supports material thickness up to 12 in. (305 mm)
  • Supports three wavelengths - 9.3 µm CO2, 10.6 µm CO2 and 1.06 µm Fiber
  • Supports two laser sources - up to two CO2 laser sources or one CO2 laser source and one permanently mounted fiber laser source
  • Patented Controllable Laser Power Density Optics
  • Patented Multi-Wave HybridTM Technology
  • Precision Material Independent Autofocus
  • Intelligent Materials Database
  • Multi-Camera Vision and Registration available
  • 21” (533 mm) Touch Screen Control Panel available
  • Patented SuperSpeedTM technology available
  • Fire Suppression Assistance available
  • UAC 4000 Air Filtration available

Features, Configuration Components and Specifications

Design File Geometry PreservationA feature that maintains curves in a design file, i.e., circles, ellipses, b-splines, Beziers, and NURBS, and ensures curves are kept throughout the path planning process rather than using linear interpolation.
Multi-Camera Vision & Registration (available)A patent pending feature that provides an augmented reality user interface by superimposing design files on images of the material placed on the material support surface and captured by multiple cameras built into the laser system.

The AR user interface facilitates precise alignment of design files using controls that allow the design file to be positioned, rotated, and scaled with real time visual feedback made possible through advanced machine vision algorithms.

This feature also supports traditional camera registration workflow using printed registration marks.
Precision Material Independent AutofocusMotorized material support structure (Z-axis) and high-resolution touch sensor.
Rapid ReconfigurationTMA patented technology that enables users to install and reinstall any supported ULS CO2 laser source onto any ULS laser system without tools and optical alignment to optimize laser processing for the widest variety of materials.
Intelligent Materials DatabaseA powerful and unique database that generates laser processing parameters for a wide variety of materials and laser system configurations. If the system configuration changes, the database automatically recalculates the parameter values.
Multi-Wave HybridTM Technology (available)A patented technology that enables a combination of laser wavelengths (up to three wavelengths) to be focused to the same focal point within the same focal plane and used either sequentially or simultaneously.
Controllable Laser Power Density 4X, 1X / 13X
(4X included, 1X/13X combination available)
A patented feature that provides the unique ability to control laser power densities while maintaining a high degree of alignment accuracy of the focal plane with the material surface as well as a Gaussian beam distribution.

Power Densities: 1X (Available), 4X (Included) or 13X (Available) for 10.6 μm and 9.3 μm wavelengths; 52X for 1.06 μm Fiber wavelength (when a fiber laser is purchased/installed).

Normalized power density (watts/cm2) = power density coefficient x 103 x average laser power (watts). Normalized power density is the power of the material processing laser(s) divided by the area of the focal spot measured at 1/e2.
Dynamic Energy StabilizationA feature that maintains even laser energy delivery regardless of the speed of the motion system.
Line Segment ReductionA user control to reduce excessive line segmentation contained in some design files.
Intelligent Path PlannerA comprehensive path planning algorithm that minimizes laser processing completion time.
Vector Acceleration ControlA user adjustable control to define acceleration of vector motion for each control file.
Path Deviation ControlA user control to adjust the allowable deviation from the intended path to increase throughput.
True Width Raster ProcessingA feature that eliminates the need for motion system over-travel beyond the edges of the raster image.
SuperSpeedTM Technology (available)A patented feature that produces two focal spots (one for each laser beam) to enable the system to deliver two independently controlled raster lines at a time. SuperSpeedTM requires a laser system equipped with two CO2 lasers of the same wavelength and power.
Automation Interface (available)An addressable device that can receive input signals and provide output signals. Enables the laser system to control external devices and allows external devices to initiate laser system functions.
21” Touch Screen Control Panel(available)A fully integrated 21” (533 mm) touch panel command and control console used to control laser system operation. Eliminates the need for a separate control computer.
Laser System Manager (LSM)An advanced user interface with a high degree of functionality and control that allows users to efficiently manage design files and laser material processing parameters.
Industry Standard Interchange Format SupportA software feature that supports industry standard graphic interchange formats including DXF, PDF, and G-Code.
Design File Relocation and Duplication ControlsA set of user controls to reposition or duplicate design files anywhere within the material processing field.
Kerf CompensationA user adjustable control that compensates for material width removed during laser cutting in order to achieve desired dimensions without changing the design file. It maintains true arc and circle geometry if present in the design.
User Access AdministrationA software administration feature for managing multiple user accounts and permissions.

GAS ASSIST

Programmable Gas Assist (requires gas and/or air sources)A feature that allows the user to program gas type and flow rate on a process-by-process basis within a control file.
Optics Protection (requires air source)A barrier of clean air that protects optical components during processing.
Coaxial Gas Assist AttachmentA gas assist attachment that directs air (or gas) perpendicular to the material’s surface.
Lateral Gas Assist Attachment (available)An adjustable gas assist attachment that directs air (or gas) laterally or at an angle to the material’s surface.
Air Compressor (available)A compressed air source that delivers optimally conditioned, clean, dry, and oil-free air for optics protection and gas-assisted laser processing.

MATERIAL HANDLING

Multifunction Material Support StructureA built-in aluminum honeycomb work surface designed to keep materials stationary and in focus during laser processing. Reduces back reflection and enables exhaust of laser processing byproducts from underneath materials. Includes a full-field masking material dispenser.

Configurable using Machined Aluminum Tiles, Material Support Pins and Vacuum Booster.
Machined Aluminum Tiles (available)An accessory that provides a rigid and smooth work surface for laser material processing. When used with cutting processes, the compatible Material Support Pins are recommended.
Material Support Pins (available)A set of custom machined pins for laser cutting that can be inserted into either the Multifunction Material Support Structure or the Machined Aluminum Tiles. Pins add sufficient space between the target material and the work surface to eliminate back reflection.
Vacuum Booster (available)An external accessory that dramatically increases the pressure differential between the material support surface of the Multifunction Material Support Structure and ambient/atmospheric pressure to keep materials stationary.
Class 4 Conversion Module for Pass-Through (available)A patented technology that enables the laser system to facilitate material pass-through in compliance with CDRH and international safety regulations for operating Class 4 laser systems. This optional, add-on module converts a fully enclosed Class 1 system into an open Class 4 system.
Rotary Axis Module (available)An accessory that enables 360° rotation laser processing of cylinders, spherically-shaped, and tapered objects. The addressable resolution is 13 arc seconds.

AIR FILTRATION and HANDLING

Intelligent Air Filtration UAC 4000 (available)An external accessory that uses a patented dual carbon filter and sensor suite (for CO and VOCs) that filters out laser processing byproducts, monitors filtration performance at every stage, and alerts the operator when predefined contaminant thresholds have been reached. Connects directly to the laser system to turn filtration on and off with laser processing and communicates the status of all aspects of the UAC 4000.

SAFETY and FACILITY

Overtemperature DetectionA safety feature designed to disable all laser sources, home the motion system, and trigger an audible alarm in the event it detects an unusually high temperature in the laser processing area.
Safety InterlocksA safety feature that disables the laser source when access doors are open as required by all major international safety standards.
Laser Blocking Laminated Safety GlassA shatterproof multi-layer laminated safety glass with appropriate wavelength filter media. Meets laser safety requirements OD 5+ for 10.6 μm , 9.3 μm and 1.06 μm wavelength laser radiation.
Metal Enclosure with Labyrinth SealsA design feature consisting of overlapping flanges that all enclosure doors or access panels must have to prevent direct line of sight into the enclosure, as required by international safety regulations.
E-StopA highly visible standards-compliant pushbutton. Once depressed, DC power to all laser sources, the motion system, and other control mechanisms are immediately shut off, while aborting all system operations.

SPECIFICATIONS

Material Processing Envelope (X,Y,Z)32 x 24 x 12 in. (813 x 610 x 305 mm)
Maximum Effective Raster Material Processing Speed
(in SuperSpeedTM configuration)
>200 in./sec (5080 mm/sec)
Number of Laser Sources Supported(2) Laser Sources - Up to (2) CO2 laser sources or (1) CO2 laser source and (1) permanently mounted fiber laser source
Laser Wavelengths and Power Available10.6 μm CO2: 10-, 30-, 40-, 50-, 60-, 75- and 150-watt laser sources
9.3 μm CO2: 10-, 30-, 50-, 75- and 125-watt laser sources
1.06 μm Fiber: 50-watt laser source
Laser Wavelength / Maximum Power ConfigurationSupports three (3) laser wavelengths – 9.3, 10.6 and 1.06 µm - of any available power combination

Single wavelength configurations:

10.6 μm: 150 watts
(with two (2) 75-watt laser sources)

9.3 μm: 150 watts
(with two (2) 75-watt CO2 laser sources)

1.06 μm: 50 watts
(with one (1) fiber laser source)


Multiple wavelength configurations:

10.6 μm & 9.3 μm: 150 watts
(hybrid beam with one (1) 75-watt 10.6 μm CO2 and one (1) 75-watt 9.3 μm CO2 laser source)

10.6 μm & 1.06 μm: 125 watts
(hybrid beam with one (1) 75-watt 10.6 μm CO2 and one (1) 50-watt 1.06 μm laser source)

9.3 μm & 1.06 μm: 125 watts
(hybrid beam with one (1) 75-watt 9.3 μm CO2 laser source and one (1) 50-watt 1.06 μm laser source)
System External DimensionsWidth:
55.00 in. (1397 mm) without Control Panel
59.31 in. (1506 mm) with Control Panel folded
83.75 in. (2172 mm) with Control Panel extended

Depth:
46.32 in. (1177 mm)

Height:
48.00 in. (1219 mm) to top of enclosure e-stop
Weight400 lbs. (181 Kg)
Weight is approximate and varies with laser source selections
Power Requirements220V-240V/16A
Exhaust RequirementsIntelligent Air Filtration (UAC 4000) or External Exhaust Blower Capable of >700 CFM at 6 in.

WG Static Pressure (1190 m3/hr. at 1.5 kPa)

6 in. (152mm) Exhaust Port
Computer RequirementsMinimum: Intel i3 processor (or equivalent) with at least 8 GB of memory, Windows 10/11 operating system, and connection to laser system with USB cable.

Computer is not required if configured with available 21” Touch Screen Control Panel
Laser Safety ClassificationClass 1 for material processing lasers
Class 2 overall due to red laser pointer
Can convert to Class 4 with optional Class 4 module
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