3M-logo-thumbBattery Manufacturing Materials

Material CategoryPotential Advantages of ULS DLMP® SolutionSpecific MaterialsMaterial Processing Notes
EMI Absorbers
  • Multiple material compatibility
  • Complex geometries with small features
  • No foam compression
  • No tooling required
  • 3M Wide Frequency EMI Absorbers (Ab)
3M™ EMI Absorber AB5020HF
EMI Gasket Materials
  • Multiple material compatibility
  • Complex geometries with small features
  • No foam compression
  • No tooling required
  • 3M Electrically Conductive Acrylic Pads (eCAP)
  • 3M Electrically Conductive Gasket (ECG)
  • 3M Metal Shielding Gaskets (MSG)
Insulating Paper
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
  • 3M CeQUIN Inorganic Insulating Paper
  • 3M TufQUIN Hybrid Insulating Paper
Thermally Conductive Interface Pads
  • Smooth edge with no lip or debris
  • Complex geometries with small features
  • No tooling required
  • No gumming of tooling
  • 3M 5516 – Ceramic Filled Silicone
3M™ Thermally Conductive Silicone Interface Pad 5516