Laser Processing of 3M™ Thermally Conductive Silicone Interface Pad 5516
3M™ Thermally Conductive Silicone Interface Pad 5516 is a highly conformable, slightly tacky silicone elastomer sheet filled with ceramic particles which provide thermal conductivity and desirable dielectric properties. 3M Thermally Conductive Silicone Interface Pad 5516 consists of a 1000µm silicone elastomer sheet covered on either side by a 125µm thick removable liner. A diagram depicting 3M Thermally Conductive Silicone Interface Pad 5516 is shown in Figure 1.
Figure 1. 3M Thermally Conductive Silicone Interface Pad 5516 diagram illustrating the top removable film liner (125µm), silicone elastomer layer (1000µm), and the bottom removable film liner (125µm).
Laser Processing Notes
3M Thermally Conductive Silicone Interface Pad 5516 was tested to assess laser processing compatibility and determine the best configuration of peak laser power and wavelength. The silicone elastomer layer in 3M Thermally Conductive Silicone Interface Pad 5516 absorbs 9.3µm energy more efficiently than other wavelengths available from ULS, meaning that laser cutting of this material can be performed at higher processing speeds with minimal discoloration using this wavelength. A microscopy image taken at 300x magnification depicting the edge of 3M Thermally Conductive Silicone Interface Pad 5516 after laser cutting is shown in Figure 2. The 3D image in Figure 3 illustrates the results of laser cutting the silicone elastomer with the system configuration of a single 75 watt 9.3µm CO2 laser source.
Figure 2. Microscopy image (300x) depicting the edge of 3M Thermally Conductive Silicone Interface Pad 5516 after laser cutting, with both the cover film and paper carrier in place. The heat-affected zone measures 260µm.
Figure 3. 3D-rendered microscopy image (300x) illustrating the edge of 3M Thermally Conductive Silicone Interface Pad 5516 after laser cutting.
Table 1. System Configuration Comparison
System Configuration | Heat-Affected Zone | Process Characteristics | Post-Processing Requirements |
---|---|---|---|
9.3µm (Recommended) | Minimal heat-affected zone of approximately 260µm | This configuration results in a clean edge with minimal heat effects and nominal discoloration | Post-processing requirements include the removal of slight surface deposition using mild abrasion |
10.6µm | Increased heat-affected zone of approximately 320µm | This configuration results in increased discoloration and heat effects along the edge |
Figure 4. Microscopy images (300x) of the edge resulting from laser cutting with the 9.3µm (left) and 10.6µm (right) wavelengths.
3M Thermally Conductive Silicone Interface Pad 5516 applications requiring fine geometry and intricate detail without degrading the physical properties of the material can be achieved with ULS technology. An example demonstrating the results of laser cutting 3M Thermally Conductive Silicone Interface Pad 5516 using the recommended system configuration is shown in Figure 5.
Figure 5. Example of the geometry possible by laser cutting 3M Thermally Conductive Silicone Interface Pad 5516 (film liner removed).
3M Thermally Conductive Silicone Interface Pad 5516 is suitable for laser processing and was extensively tested to determine the optimal processing configuration. Through this testing, it was determined that laser cutting is viable with this material and that using a 75 watt 9.3µm CO2 laser source is the recommended system configuration. 3M Thermally Conductive Silicone Interface Pad 5516 efficiently absorbs the 9.3µm wavelength laser energy to produce a processed edge that has a minimal heat-affected zone and nominal discoloration.