Pyralux^® is a DuPont^® flexible circuit material consisting of laminated layers of copper, adhesive, polyimide, and other components. Laser processing Pyralux^® can be performed with a 1.06 micron fiber laser and a 9.3 micron CO₂ laser. The 10.6 micron laser is able to ablate the organic components of Pyralux^®. However, processing with a 9.3 micron CO₂ laser results in a significant reduction in carbonization as compared to the 10.6 micron CO₂ laser. Laser cutting of Pyralux^® is performed with a Multiwave Hybrid^™ (the laser beams are combined into one coaxial beam) laser process consisting of the 1.06 micron fiber and 9.3 micron CO₂ laser energy. The fiber laser ablates the copper, while the CO₂ laser ablates the adhesive and polyimide layers creating a clean sharp cut edge in a single process. Laser engraving of Pyralux^® is also performed with a 9.3 micron CO₂ and 1.06 micron fiber laser in a Multiwave Hybrid^™ laser process. The CO₂ laser ablates the polyimide and adhesive layers, while the 1.06 micron fiber laser ablates the carbon buildup to expose the underlying copper. Laser marking of Pyralux^® can be performed with a 1.06 micron fiber and creates a sharp black mark.